Hello Madan,

You can call CVD Systems & Services and speak to Bob Campbell at
610-792-1690. He would like for you to fax over your request; number of
wafers, wafer size, thickness, so he can quote you. He says they do this
sort of work all the time along with other micro machining and
deposition work.
His fax number is 610-792-1691

If you need help with dicing blades to cut the wafers into individual
die please give me a call. We sell dicing blades for cutting silicon,
GaAs, glass, pyrex and other materials. We understand budgets are not
alway very big we offer a 10% discount to all Universities. We can also
help with process development in dicing or grindingof your silicon
wafers.

Thank You!!

Mario Robles
650-966-8001 phone
650-966-1881 fax