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MEMSnet Home: MEMS-Talk: Opening of Plastic Packages
Opening of Plastic Packages
2000-04-10
Erik Jung
Opening of Plastic Packages
Erik Jung
2000-04-10
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Dear Colleagues,
We would need to open plastic encapsulated IC packages for failure
analysis. Is there another method besides HNO3 spray etch or CF4 plasma
etch?
The method should be able to open 10-20 packages a day, but we are happy
for any suggestions.
Thank you!

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