Hi, folks,

I am facing difficulty of depositing 1 micron thick Al on glass capillary of 80
micron diameter. In order to get good uniformity, I need to rotate it. I have
hard time to calculate the deposition rate. I am using e-beam evaporation. Do
you think sputtering will be better? Rotation control is also a big problem.
Any idea of how to do this process is highly appreciated. Thanks a lot.

Ingrid
MAL Lab, UIC