Has anyone had success in finding/developing a dicing saw with a vision
system that can see through the backside of the wafer onto the surface
circuitry for alignment purposes WITHOUT having to backpolish the wafer?

I have seen standalone vision tests done using IR on a 740µm thick wafer
with slightly grainy results, but good enough for a human to decipher.
1) Are there any better vision solutions out there? or
2) Is there imaging software that can take grainy results and process it in
a way suitable for automatic alignment/pattern recognition on a dicing saw?

Your advice/experience is much appreciated,
Dean R. Eshleman