Hello all

I am trying to pattern polyimide on silicon nitride wafers. When i dispense
the polyimide on the wafer and spin it for the required thickness i find the
polyimide shrinking from some areas of the wafer and morae and more
shrinking of the polyimide taking place within a minute of spinning.

Also i would like to know if anyone has an optimum recipe for the dispensing
and treating polyimide.

Also i want to know how we can bond two patterned polyimide back to back  (
whether it can be done after curing or should it be packed back to back and
cured with heating). Does any one know how to do bonding of polyimide.

Help in this regard would be greatly appreciated.

Thanx

Gururaj Shenoy
Lousiana Tech University

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