Dear Sonia,

It's the current density that matters, not the current!

For the bath I use, Orotemp 24-RC from Technic, 50 C is a good temperature,
and the current density should be around 3 amps per square foot. If you're
using a similar bath, and you're plating the entire surface of an
unpatterned 2 in wafer, then 50 mA is about right. But if you have patterned
the surface then 50 mA might be much too high. On the other hand, if you're
plating an unpatterned 6 in wafer, then 50 mA might be way too low!

Best regards,
Jordan
--------------------------------------------------------
Jordan M. Berg, Ph.D., P.E.
Associate Professor of Mechanical Engineering
Texas Tech University
Lubbock, TX 79409-1021

[email protected]

> Message: 10
> Date: Fri, 25 Jan 2002 15:23:14 +0000 (GMT)
> From: Sonia Garcia Blanco 
> To: 
> Subject: [mems-talk] Electroplating Gold
> Reply-To: [email protected]
>
> Dear All,
>
> I am trying to electroplate gold on top of silica: for that I sputtered a
> few nm Ti and then few nm of gold on top of the silica and place that in
> the electroplating solution at 50C. I used a current of 50mA that will
> give us around 2 micron thick layer of gold in 20min.
>
> The surface appear with a lot of roughness.... Could somebody give me some
> advice? Am I using the correct parameters for current and temperature to
> get an uniform layer?
>
> Thank you very much for your help!
>
> Sonia.