Hello Jorn,

If you try to get by without an adhesion layer, you're asking for
delamination problems.  Believe me, I've seen enough of this problem in the
past.

A thin layer of Ti or TiN (~400 angstroms) will provide a nice adhesion
layer.

Best regards,

Mark Rousey-Seidel
Customer Applications Manager,
Tegal Corporation

-----Original Message-----
From: Jvrn Koblitz [mailto:[email protected]]
Sent: Wednesday, March 13, 2002 2:05 AM
To: [email protected]
Subject: [mems-talk] Adhesion layer for Pt films (high temp application)


Dear MEMS-talk members,

I am looking for a suitable adhesion layer between an LPCVD SiN
substrate layer and a 0.5 micron thick platinum layer (used as bond
pads) that is stable up to 600 deg. C.
Ideally, we would use the Pt without any adhesion layer, but I fear that
long-term stability/reliability could be an issue then. We apply
sputtering of the Pt and do have tantalum, titanium, TiN and Cr targets
in use with our sputtering machine.
Can anyone propose a suitable solution or even process?

Many thanks in advance.

Joern Koblitz
microFAB Bremen GmbH
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/