Dear Jeorn,
You might try to put a thin layer of polysi on top of your structure
followed by thicked platinum. At the high temp cycle, Some Pt silicide will
form but you will still have platinum left

Shay Kaplan

Jvrn Koblitz wrote:

> Dear MEMS-talk members,
>
> I am looking for a suitable adhesion layer between an LPCVD SiN
> substrate layer and a 0.5 micron thick platinum layer (used as bond
> pads) that is stable up to 600 deg. C.
> Ideally, we would use the Pt without any adhesion layer, but I fear that
> long-term stability/reliability could be an issue then. We apply
> sputtering of the Pt and do have tantalum, titanium, TiN and Cr targets
> in use with our sputtering machine.
> Can anyone propose a suitable solution or even process?
>
> Many thanks in advance.
>
> Joern Koblitz
> microFAB Bremen GmbH
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