Paolo,
      At least one company has used our equipment to do this.  We have an off
the shelf Polymide bake oven that goes to 450 degrees centigrade, with a
controlled atmosphere or vacuum.  They requested a 10-7 vacuum oven to produce
a vacuum under the frit, then a temperature rise to produce a glass frit melt.
This sealed the area under the frit at a 10-7 vacuum.  If this is the sort of
equipment you are looking for please contact me for further details.  Bill
Moffat

-----Original Message-----
From: Liz Shelley [mailto:[email protected]]
Sent: Thursday, March 14, 2002 8:39 AM
To: [email protected]
Subject: Re: [mems-talk] GLASS FRIT


Contact FERRO Corporation
Cleveland, OH


> From: Paolo Bondavalli 
> Organization: THALES LCR
> Reply-To: [email protected]
> Date: Thu, 14 Mar 2002 16:58:57 +0100
> To: [email protected]
> Subject: [mems-talk] GLASS FRIT
>
> Dear Mems Experts
> We are tried to use glas frit in order to realize hermetic packaging of
> MEMS.
> Could you give me more information about this technique?
> The cure temperature, the principal suppliers, publications about it...
> Thanks a lot
> have a nice day.
>
> *********************************************************
> Dr. Paolo Bondavalli
> R&D Engineer
> LABCOM - Laboratoire Interconnexions Optiques et MEMS
> THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
> Domaine de Corbeville,
> Route Departementale 128
> F91404 ORSAY
> (FRANCE)
> Tel : 01 69 33 08 63
> Fax : 01 69 33 08 62
> Email : [email protected]
> **********************************************************
> Disclaimer: Opinions expressed herein are my own and may
> not represent those of my employer.
> **********************************************************
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