Bill:

Actually, we at IMT currently have extensive liftoff capabilities for metals
and I don't believe we have seen problems of the type you describe.  If I am
misunderstanding or you would like to discuss further, please contact me
offline.

Thanks and regards --Monte

Monteith G. Heaton
VP Marketing and Sales
Innovative Micro Technology
75 Robin Hill Road * Santa Barbara, CA  93117
Ph:  805-681-2852 * Fx:  805-967-2677
[email protected] * www.imtmems.com
_________________________________________
"Your strategic partner for MEMS design and 6" wafer
manufacturing services with 0.355m photolithography,
30,000 sq. ft. fab, and non-CMOS materials flexibility,
including metals/magnetics."

>Bill Moffat wrote:
Message: 2
Subject: RE: [mems-talk] Cu Electric Deposition in Cleanroom?
Date: Mon, 1 Apr 2002 09:10:36 -0800
From: "Bill Moffat" 
To: 
Reply-To: [email protected]

Monte,
      We at YES have produced an image reversal unit to allow a lift off
profile for metal lift off.  It is a standard process in the GaAs, Indium,
Lithium market.  As it seems to answer some of the problems for the MEMS
guys it is possible we will have to look into is our method of resist
definition compatible with your type of metal deposition.  If this is the
case we may investigate it together to see if we can answer some of our
customers requests better.  I am aware this may not fit with your ability to
etch as etch is not required with lift off.  But if the geometry or metal
type is such that lift off is the best answer we should be prepared.  The
only criteria for metal lift off is the metal deposition should not be too
high a temperature at the substrate to avoid frying the resist.  If there is
any interest on a co-operative effort please contact me.  Bill Moffat,
C.E.O. Yield Engineering Systems.  408 954 8353