A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Full Wafer Bonding
Full Wafer Bonding
2002-04-03
Steffan Anon
bonding SU-8 to GaAs
2002-04-03
Christopher F. Blanford
2002-04-03
Palensky Joshua
Full Wafer Bonding
Palensky Joshua
2002-04-03
Hello Zomy,

You can check out several papers on this subject at:
http://www.evgroup.com/papers/compoundpapers.htm

Best Regards,
Josh Palensky
EV Group
(602) 437-9492


-----Original Message-----
From: Steffan Anon [mailto:[email protected]]
Sent: Wednesday, April 03, 2002 2:29 AM
To: [email protected]
Subject: [mems-talk] Full Wafer Bonding


Hi everyone,

I'm looking for Information about full wafer bonding of 3 inch wafers using
polyimide or SOG (Spin on Glas) as intermediate layer.

We try to bond GaAs to glas with an optical transparent layer that is
resistant to temperatures up to 300 degree celsius.

Best regards

Zomy



---------------------------------
Gesendet von http://mail.yahoo.de.
Sie brauchen mehr Speicher f|r Ihre E-Mails? - http://premiummail.yahoo.de.
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Process Variations in Microsystems Manufacturing
Mentor Graphics Corporation
Harrick Plasma, Inc.
MEMS Technology Review