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MEMSnet Home: MEMS-Talk: removing dies from packages
removing dies from packages
2002-04-09
Andrew Cao
2002-04-10
Mark West
2002-04-10
Bill Moffat
2002-04-10
[email protected]
removing dies from packages
Bill Moffat
2002-04-10
Andrew,
       An Oxygen plasma can remove the plastic package.  We had a customer who
ran this process.  Be aware of high temperature.  This customer ran 10 minutes
plasma followed by 15 minutes cool down followed by10 minutes plasma etc.  It
took all weekend to remove the package.  Also be aware that most commercial
plasma units have electrons in the plasma and these free electrons can change
the electrical characteristics of the die when they diffuse in.  For example
it is common for MOS devices to die in less than 5 minutes of normal active
plasma.  Hope this helps.  Bill Moffat

-----Original Message-----
From: Andrew Cao [mailto:[email protected]]
Sent: Tuesday, April 09, 2002 3:17 PM
To: [email protected]
Subject: [mems-talk] removing dies from packages


Hi
I'm trying to remove the dies from a TO-92 pacakge.
Does anyone know of a chemical that can dissove the
plastic package without damaging the die.  Would a
oxyen plasma be able to burn off the plastic.  Thanks
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