Hello Phil,

You can try using a 10-15min pause between two
successive scans, this might help cool down your
substrate.
I have sputtered Aluminum with lower power (5KW) and
have seen my substrate get hot. 9KW sure is much
higher, so lowering power will help too.
Hope that helps.
Have you ever had delamination problem with your
target?

regards,
adnan

--- "Klauder, Jr., Philip R."
 wrote:
> Gentlemen-
>       I have developed a problem with our Sputterer
> recently, that has me
> frustrated.
> I have an MRC 943 with a DC Magnetron Cathode. I'm
> using it to sputter 2
> microns of aluminum on Pyrex substrates. This
> process has been stable for
> years, but suddenly my substrates are bowed and very
> hot to the touch when
> they come out of the Sputterer.
>       The only cooling in the machine has always been the
> water cooling of
> the cathode block. The Aluminum target is clamped to
> that block. I am using
> the same 9KW power that I have always used. The
> cooling water flow rate is
> good. I can't figure out what has changed and I'm
> stumped. Any suggestions?
>
> Phil Klauder
> 215-646-7400  x2151
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