Polyimide etch can be performed in a non-loadlocked diode etch system using
O2/fluorine chemistries at moderate pressures of <500 mTorr.  Etch rates are
typically 7,000 to 10,000 A/minute.  The profile is largely driven by the
profile of the photoresist, since selectivity is 1:1.  We have demonstrated
this application for several customers.  Feel free to contact me if you have
further questions.

Best regards,

Mark Rousey-Seidel
[email protected]