on 6/20/02 11:56 PM, Peter & Judy Wright at [email protected] wrote:

> Does anyone know of an etchant that can be used to remove a Ti/W underbump
> metalization and that will not attack Sn or Pb?
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You can try H2O2 (hydrogen peroxide) undiluted.  It etches at about 500-1000
E per minute.
Brad