Dear colleagues,

I have an array of out-of-plane corugations two microns in height.  My goal
is to passivate these corugations with a dielectric, preferably, and then
polish to remove any undulation in order to conduct a hermetic ES-bond.

I have tried various SOG's, including Allied Signal's 712, but could not
obtain desired result.  I recognize that various factors, such as lapping
padding, slurry, etc., play important roles to achieve this goal.


Does anyone have an experience in this regard that can be shared?

Thanks.


Robert S. Okojie

[email protected]