Hi Nan Jing,

Our lab has PECVD, please refer to http://www.mal.uic.edu/facilities.asp
Good luck.

Dr. Hongjun Zeng
Microfabrication Applications Laboratory (MAL)
University of Illinois at Chicago
ERF Building, 842 W. Taylor Street
Chicago, IL 60607-7022
Room 3014 ERF
Tel.: 312-413-5889, Fax: 312-996-6465


-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of [email protected]
Sent: Friday, July 26, 2002 11:00 AM
To: [email protected]
Subject: MEMS-talk digest, Vol 1 #357 - 9 msgs

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Message: 1
To: [email protected]
From: "Nan Jing" 
Date: Thu, 25 Jul 2002 13:50:22 -0400
Subject: [mems-talk] Urgent Help:PECVD SiO2 film with TENSILE residual
stress
Reply-To: [email protected]

Dear MEMS community,

   I'm now doing some mechanical property testing of silicon dioxide film in
MEMS device and my experiment requires a deposited SiO2 film with TENSILE
residual stress.
   But my school doesn't have a PECVD equipment right now. So I checked the
MEM-EXCHANGE to see if they could find a fab which has this capability and
experience. But unfortunately they told me that they couldn't find any fab
which can deposit PECVD SiO2 film with tensile residual stress, all of them
are
compressive.

   Is there anyone know any fab or company has this capability or had this
experience before? Thank you very much for any info.!!!

-Nan Jing
Department of Materials Science and Engineering
CWRU

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