Looking for component level high vacuum(1mtorr to 5 mtorr) package sealing
Lucy Huang
2002-10-02
We need the foundry service for the component level vacuum package
sealing for our MEMS devices, if you have the capability or know which
company has this equipment to do so, please contact to me.
Lucy X. Huang
MEMS Engineer
755 Phoenix Dr.
Ann Arbor, MI 48108, U.S.A.
Tel 734-528-6360
Fax: 734-528-6367
E-mail: [email protected]
www.discera.com
