Dear Colleagues

I am looking to RF sputter a thin film of tin (100 to 300 nm) onto
either Si3N4 or Si. I wonder if anyone knows the deposition rate of this
metal and an appropriate voltage at which to deposit it?

N/B. The sputtering system has a base pressure of 1 E-6 Torr, a
sputtering pressure of 1 E-2 Torr and the gas is Ar.