Is it possible to plate electroless Ni on Au? I have exposed gold pads, in
openings in a silicon nitride passivation layer, which I want to bump. I
would like to use Ni as the UBM and electroless deposition would save me a
photolithography step. If it is possible, what is the chemistry that is
required to catalyze the reaction and will the Ni film adhere well to the
Au?

Thanks for any help.
Peter Wright