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MEMSnet Home: MEMS-Talk: 3d chip integration (packaging), interconnection and housing in one step
Shadow Mask
2002-11-22
Richard Morrison
3d chip integration (packaging), interconnection and housing in one step
2002-11-22
Andrea Reinhardt
3d chip integration (packaging), interconnection and housing in one step
Andrea Reinhardt
2002-11-22
To everybody interested in using this new technology (3D-CSP) which will not
require any classical bonding and offers more possibilities in making the
components as small as possible, we will send a PowerPoint presentation for free
(in print or on cd), please just forward your mail address

Regards
Andrea

----- Original Message -----
  From: Richard Morrison
  To: [email protected]
  Sent: Friday, November 22, 2002 6:15 PM
  Subject: [mems-talk] Shadow Mask


  Call  Photo Sciences they have made Shadow mask they are excellent, Tel#
310-784-7460

  Rick

  Rick Morrison
  Sr. Semiconductor Engineer
  Radant Mems Inc.
  255 Hudson Road
  Stow Ma, 01775
  Tel- 978-562-3866
  Cell 508-801-4796
  AMS Phone: 508-770-3521
  EMAIL  [email protected]

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