I am interested in the latest and greatest processsing specs for Shipley
SJR-5740.
My typical process uses bake and exposure times for 40 microns total
thickness achieved in 2 spins using hot-bake cure, moisture re-absorb, and
exposure using a Suss MA6 with 1000W lamp.
I am interested in tweeking of this processes to achieve the best critical
tolerance defintion over 40 microns of thickness.

Dale Boehme
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AXSUN Technologies Inc.