Dear Members,

I found some cracking issue during SU-8 developing process.
Crack was found at corner area. Our via is square and size is 4mmx4mm.(it is
very big)
So it is very hard to control the crack or delamination.

Please share your experience on this issue.
I'm looking forward to hearing your suggestion or recommendation on SU-8.

Thanks in advance.

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    Seung Wook (Uk) , YOON   Ph.D

  Senior Research Engineer
  MMII, MMC Lab
  Institute of Microelectronics (IME)
  A-Star, Singapore
  11Scenence Park Road,
  Science Part II, Singapore 117685
  Phone (Office) 65-6770-5442
  Fax (Office)     65-6774-5747