Hi Helen

This sort of glass can be very difficult to etch.  You cannot use simple
fluorine chemistry, as you would for quartz, as this will not remove the
alumina.  This can only be removed by including chlorine or bromine in the
gas mixture.  Some work has been done on this using Freon 22 (CHClF2), but
this is one of the refrigerant gases that are increasingly difficult to get
hold of.

Please note, if you are using chlorine or bromine containing gases in your
RIE chamber, you should take precautions against breathing HCl or HBr which
will be released from the chamber walls on contact with moist air.  Open
load chambers should really be used inside a nitrogen glove box.  Even
better is to use a load-lock, so the process chamber never normally sees
atmosphere.

Martin

Martin Walker B.Sc.(Tech.) M.Sc.
Tactical Marketing Engineer
Oxford Instruments Plasma Technology
North End, Yatton, Bristol, BS49 4AP UK
T.+44 (0)1934 837031  F.+44 (0)1934 837001
E. 
W. 

>Date: Tue, 8 Apr 2003 08:21:59 -0700 (PDT)
>From: Helen Li 
>Subject: [mems-talk] Glass RIE
To: [email protected]
>Message-ID: <[email protected]>
>Content-Type: text/plain; charset=us-ascii
>
>Hi,
>
>I am looking for some processing parameter for glass
>RIE as reference. My glass contains
>SiO2/Na2O/K2O/Al2O3/MgO.
>
>Can anyone with the similar experience of glass RIE
>help me?
>
>Thanks,
>Helen
>
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