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Re: deep Si etching (Nickolay Lavrik)
Poission's ratio of silicone rubber (Ebin Liao)
Re: internal stress SOI (Matthieu Guirardel)
Re: Wafer size reduction services (Dirk De Bruyker)
Re: RIE vs DRIE (Roger Shile)
SPIE Press book on Electroactive Polymers (EAP) (Yoseph Bar-Cohen)
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