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RE: Electric breakdown in MEMS air gap (Ralf Longwitz)
3-D Imaging Through Polysilicon (David Schreiber)
MOEMS Packaging question (Anthony Sun)
piezocofficients of Si(100) along <110> (anant narain)
Pyroelectric Device (Daniel McGregor)
looking for sources about microwave design & MEMS (杨尊先)
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