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  • von mises stress ([email protected])
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  • Adhesion layers for PECVD oxide (Paolo Tassini)
  • 8" MEMS wafer fab (Louis Chomas)
  • 8" MEMS wafer fab ([email protected])
  • Flexus F-5000 Film Stress Gauge (Phillipe Tabada)
  • Photoresist or Cr delamination problem (Richard Beaudry)
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