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material thermal and electrical properties (Sebastian Sosin)
Re: SiO2 on GaAs by ebeam evaporator (DARREN S GRAY)
SOG for wafer bonding (Zhimin J Yao)
Low stress thermal oxide? Tensile stress? (Zhimin J Yao)
Micro-heater in a channel? (Zhizhong Yin)
RE: DRIE sidewall angle (Johnston, Ian)
Anisotropic Silicon Dioxide Reactive Ion Etching (frank berisford)
Re: SiO2 on GaAs by ebeam evaporator (Philip D. Floyd)
questions for Tungsten on BCB (hzhu5@imap2.asu.edu)
SiO2 on GaAs by ebeam evaporator (Brent Garber)
(2 parts)
Anisotropic Silicon Dioxide Reactive Ion Etching (Isaac Wing Tak Chan)
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