The NIST researchers, including Samuel Stavis and Craig Copeland, described their work in the Journal of Microelectromechanical Systems. As in their previous work, the team labeled the MEMS ...
(Nanowerk Spotlight) One of the most pervasive reliability problems facing the computer chip industry is ESD (electrostatic discharging) failure caused by the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field.
The top layer consists of junction-less devices fabricated at a temperature below 525 0 C in a silicon layer transferred by wafer-to-wafer bonding. The resulting stack demonstrates how the 3D sequential approach can be deployed to obtain an aggressive ...
Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, today announced new epoxy die attach capabilities for silver sintering. High-speed and precision jet dispensing ...
(Nanowerk News) What if a sensor sensing a thing could be part of the thing itself? Rice University engineers believe they have a two-dimensional solution to do just that. Rice engineers led by materials scientists Pulickel Ajayan and Jun Lou have ...
