These wires pass through tiny openings, called Through-Silicon-Vias (TSV), made in the core of the silicon layer of each chip. “This superposition reduces the distance between circuits, and thus considerably improves the speed of data exchange,” ...
Their proof of concept was a microelectromechanical system (MEMS) capable of sensing pressure. The press release describes how the sensor operates and is charged: The heart of the sensor is a vibrating cantilever, a thin beam attached at one end like a ...
Imec's silicon photonics platform densely integrates photonics and electronics, manufactured on standard microelectronic CMOS manufacturing processes. The high quality and reproducibility of the photonic waveguides and devices with features measuring ...
With MEMpax®, SCHOTT North America, Inc. is now introducing a new, thinner, high quality borosilicate glass to the market for use in micro-electro mechanical systems (MEMS) technology. It will be available in thicknesses ...
The VN-100 Rugged is a miniature, high-performance orientation / inertial sensor built on a 9-axis suite of factory calibrated MEMS accelerometers, gyroscopes and magnetometers. Its compact design (33 x 26 x 9 mm), low mass (13 g) and robust aluminum ...
