MEMS technology

Xilinx releases stacked silicon interconnect
It uses 3D packaging technologies and through-silicon vias (TSV) for its 28nm 7 series FPGAs. Xilinx's Targeted Design Platforms claims to be able to handle ...
yesterday Fudzilla - MEMS technology
Vertical die stacking goes 3D without TSV
3D integration with through-silicon via (TSV) technology offers the highest level of integration, but TSV is several years away from full commercial ...
today ElectroIQ - MEMS technology

MEMS business

DALSA Reports Record Third Quarter 2010 Revenue; Increases Dividend
I am particularly encouraged by our progress in MEMS. In the third quarter, MEMS shipments increased significantly, quarter over quarter, ...
today MarketWatch (press release) - MEMS business
I-Micronews - MEMS BUSINESS/MARKET: Digital MEMS microphones from ...
L) launched its next-generation digital silicon micro-electro-mechanical-systems (MEMS) microphones, the WM7210 and the WM7220. The digital MEMS are manufactured with Wolfson's CMOS/MEMS membrane design, similar to the company's analog ...
today - MEMS business
Mandates to boost auto MEMS sensor market in Korea and Japan, says iSuppli
New mandates set to increase the safety of vehicles in South Korea and Japan will cause market revenue for MEMS automotive sensors in those countries to ...
today Digitimes - MEMS business
STMicro Reports 3Q Earnings
STMicro saw revenue growth across most of its product lines, but fared particularly well in microelectromechanical systems (MEMS) chips used to sense motion ...
yesterday Morningstar.com - MEMS business
I-Micronews - MEMS BUSINESS/MARKET: Gaming market reveals changes ...
The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. In a $418M consumer gyroscope market in 2010, gaming represents a market segment of $162M according ...
today - MEMS business
thumbnailXilinx announces 28nm FPGA family, fabricated by TSMC
Xilinx has announced its 28nm 7 series FPGAs, which embrace 3D packaging technologies and through-silicon vias (TSV) for applications requiring ...
yesterday Digitimes - MEMS business
MEMS gyroscope market says gaming FTW, though smartphone apps growing
This is most apparent with MEMS gyroscopes. The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS ...
today ElectroIQ - MEMS business
Cascade Microtech to Discuss Latest Breakthroughs in 3D Device Test ...
Mr. Smith will discuss how contacting at TSV pitches is practical with evolutions of existing probe technology, and how new probe technology enables test ...
today MarketWatch (press release) - MEMS business
MEMSCAP: 8% Net Profit for the Third Quarter 2010
MEMSCAP (Paris:MEMS)(NYSE Euronext: MEMS), the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, ...
today Business Wire (press release) - MEMS business

Featured Event

MEMS Exectutive Congress

In its sixth year, MEMS Executive Congress is the executive conference that connects the MEMS supply chain with MEMS end-users. Through keynotes, panel discussions, and numerous networking opportunities, MEMS Executive Congress creates an intimate forum for decision-makers to grow the global MEMS market. Register today!

Event Calendar

IEEE Sensors 2010
2010-11-01 - 2010-11-04
Waikoloa Beach, Hawaii
The 9th Annual IEEE Conference on Sensors

Visit MNX at Booth 9 and at Special Session VIII

MEMS Executive Congress 2010
2010-11-03 - 2010-11-05
InterContinental Montelucia, Scottsdale, AZ, USA
The 6th MEMS Industry Group (MIG) hosted event

3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets

IEEE MEMS 2011
2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

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