MEMS technology

Next Generation Power Packages for Implantables
Another solution may be the use of metal filled through-silicon vias (TSV). When using this method, the die size is expanded to include non-active silicon ...
yesterday ECNmag.com - MEMS technology
Analog Devices introduces high-performance MEMS microphones for ...
This digital document is an article from VoIP Monthly (Voice over Internet Protocol), published by Information Gatekeepers, Inc. on April 1, 2010. The.
admin today - MEMS technology
InvenSense integrates 3-axis gyroscope, 3-axis accelerometer on a single ...
The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard ...
yesterday ElectroIQ - MEMS technology
SUSS MicroTec and Fraunhofer IST Introduce New Technology for ...
Selective plasma activation can be applied to a variety of MEMS, optical and solar applications using direct wafer bonding or surface modification for the creation of micro mirror arrays, micro valves, sensors or micro fluidic channels. ...
today - MEMS technology
3D ICs in the spotlight at IMAPS
In the session "3D Interconnect Technologies in Research Triangle Park," practitioners from the region (Microelectronic Consultants of NC, RTI International ...
today ElectroIQ - MEMS technology

MEMS business

Report: Gaming Market Reveals Changes in MEMS Gyroscope Landscape
The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. ...
today Product Design & Development - MEMS business
HP aims for MEMS sensing service
Delivering the keynote address at the 2010 MEMS Executive Congress, Duncombe said MEMS is a unique technology that has been disruptive for 25 years, ...
today EE Times India - MEMS business

Nanotechnology

So what is Graphene? It's the world's thinnest and strongest nano ...
Just one atom thick, graphene is the world's thinnest and strongest nano-material, almost transparent and able to conduct electricity and heat. As a result, graphene is described as the best material to replace silicon semiconductors. ...
stuartneil today - Nanotechnology

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3-D Architectures for Semiconductor Integration and Packaging

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Event Calendar

3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets

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IEEE MEMS 2011
2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

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