MEMS technology

thumbnailArtificial kidney made by Indian American awaits human trials
Roy, whose background is in the development of medical devices using micro-electromechanical systems (MEMS) technology, has also worked on the development ...
2010-12-03 Sify - MEMS technology
thumbnailSamsung tips six predications in IC scaling
''Many groups have reported through-silicon-via based 3D IC (TSV-3D IC) where a single integrated circuit is built by stacking silicon wafers or dies and ...
today EETimes.com - MEMS technology
Mask Aligner Lithography for MEMS and Packaging - wesrch's posterous
SUSS Micro-Optics, Micro-Optics in Front-End Lithography, Micro-Optics is Key Enabling Technology in Front-End Lithography, MEMS: Photolithography, Mask Aligners used for MEMS, Packaging and SEMI, Mask Aligners Lithography is Shadow ...
today - MEMS technology
thumbnailDry-transfer graphene method can target specific applications
... new material for a wide variety of applications, including high-frequency electronics, opto-electronic devices, and micro-electromechanical systems. ...
today SPIE Newsroom - MEMS technology
New Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing ...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that ...
2010-12-03 Global SMT & Packaging Magazine - MEMS technology

MEMS business

ALLVIA to Present Advanced Logic Applications for Silicon Interposers and ...
See http://techventure.rti.org/ Located in Silicon Valley, ALLVIA is the first Through-silicon via (TSV) foundry and introduced the term "through-silicon ...
today Marketwire (press release) - MEMS business
MEMS, GSAT, DLIA, HIRU, EEGI - Stock Updates! from CRWEfinance.com ...
MEMSIC, Inc. (Nasdaq:MEMS) a leading MEMS solution provider, announced on November 30, 2010 that Dr. Paul M. Zavracky will join MEMSIC as President of North American and European Operations. A director of the company since 1999, ...
today - MEMS business
Media Alert: Cadence to Present and Showcase Technology at RTI's 3D ...
WHAT: Cadence will demonstrate its 3D IC and through-silicon vias (TSV) capabilities through videos and demos at RTI's 3D Architectures for Semiconductor ...
today Marketwire (press release) - MEMS business

Nanotechnology

thumbnailSuper-Strong Polymer/Carbon Nanotube Blend Outperforms Kevlar
They have created an exotic blend of polymer and the ubiquitous nanomaterial, carbon nanotubes, that is stronger than Kevlar. The new material has extremely ...
today DailyTech - Nanotechnology

Nanotech business

Eastern NY Becoming Nano Technology Hotbed
The region is home to the University of Albany's College of Nanoscale Science and Engineering (CNSE) and will be the home of a new semiconductor plant, ...
today NY Convergence - Nanotech business

Featured Process

e-Beam Lithographic Services from MNX

MNX offers commercial e-beam lithography services using a state-of-the-art Vistec EBPG 5000+ direct-write tool. This affordable service provides you with the best performance and fastest turnaround times in the industry.
  • 50MHz scan speed
  • Spot size below 2.5 nm
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Event Calendar

3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets

Meet MNX at this event

IEEE MEMS 2011
2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

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