MEMS technology

Bonded SOI wafer claims higher mobility
Soitec's direct wafer-bonding technique is being used to transfer thin mono-crystalline silicon layers onto sapphire substrates. ...
today ElectronicsWeekly.com - MEMS technology
thumbnailSamsung Introduces High-Density 'Stacked' DIMMs
The module, which will be based on a 40nm production process, will use a special bonding technique called "through-silicon via" (TSV), which stores memory ...
today PC Magazine - MEMS technology
Micromirrors switch fast enough for laser-directed quantum computing
Durham, NC and Madison, WI--A laser guided by a microelectromechanical beam-steering system that aims and focuses laser light pulses onto single atoms for ...
today OptoIQ - MEMS technology

MEMS business

Semiconductor Groups Form 3D IC Standards Efforts to Save Moore's ...
The program will be administered by SEMATECH's 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and working in partnership with SRC, the program aims to establish the ...
siliconcowboy today - MEMS business
DALSA Media Advisory: MEMS and Packaging Research Facility Receives $14.1 ...
The MICC will house some of the world's most sophisticated equipment for 200mm based microelectromechanical systems (MEMS) and 3D Wafer Level Packaging ...
today Marketwire (press release) - MEMS business
Semtech and IBM Join Forces to Develop High-Performance Integrated ADC/DSP ...
The interposer also connects to a package using copper TSV technology. Figure 1 shows a cross section of the 3D chip with actual SEM cross sections of the ...
today Business Wire (press release) - MEMS business

Nanotechnology

Scientists learn to make origami at the nanoscale with DNA | Nano ...
Dr. Shawn Douglas, Harvard University, said they now can build “a series of nanoscale three-dimensional parts, such as gears, bent tubes or capsules that could unite to create more complex medical instruments and functional. ...
admin today - Nanotechnology
thumbnailAn Element of Nobel-ity: Michigan Tech's Carbon Connection
Just one atom thick, it is the world's thinnest and strongest nanomaterial, almost transparent and able to conduct electricity and heat. ...
today Michigan Tech News - Nanotechnology

Nanotech business

Shrink and EV Group Partner to Develop and Manufacture Nanotech StemDisc Products
It claims the process means the resulting products retain desired features right down to the nanoscale, while eliminating the need for cleanrooms and other ...
today Genetic Engineering News - Nanotech business

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3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
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2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

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2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

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