MEMS technology

thumbnailSamsung 8GB RDIMM utilizing 3D TSV technology
Samsung claimed its TSV technology is a key to solving the paradox of driving lower power consumption in servers, while increasing memory capacity and ...
today Digitimes - MEMS technology
Breakthrough towards lab-on-chip system for fast detection of single ...
In order to do this, advanced microfluidic components have been fabricated and optimized, such as a miniaturized pump for on-chip generation of high ...
today - MEMS technology
[IEDM] TSMC Announces 3D Chip Technologies Using TSVs
TSMC prototyped a module by using elemental technologies such as TSV, rewiring layer and micro bump and three-dimensionally stacking semiconductor chips and ...
today Tech-On English - MEMS technology

MEMS business

SEMATECH, SIA and SRC Team to Establish New Collaborative Program for Enabling ...
Administered by SEMATECH's 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, ...
today Nanotechnology News (press release) - MEMS business
thumbnailQuebec MEMS research facility cops $14.1M federal grant
The MICC will house some of the world's most sophisticated equipment for 200mm based microelectromechanical systems (MEMS) and 3D Wafer Level Packaging ...
today Electronic Technology & Products - MEMS business


thumbnailA nanoscale look at how lithium batteries work
The researchers say that, although the process has been extensively studied at the device level, it remains virtually unknown at the nanoscale level of ...
today - Nanotechnology
thumbnailTracking ultrafast laser ablation to tune nanoparticle films
... also has potential applications in micro-machining, laser-induced breakdown spectroscopy, nanoparticle generation and film deposition. ...
today - Nanotechnology

Featured Event

3-D Architectures for Semiconductor Integration and Packaging

This conference gives a broad, yet thorough perspective on the technomarket opportunity and challenge offered by building devices and systems in the vertical dimension. Industry leaders from around the world are invited to speak at this conference on a wide range of topics important to the emerging and on-going 3-D integration and packaging.

Visit here for details and register today!

Event Calendar

3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets

Meet MNX at this event

2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

Terms of use     Comment on this mailing     Unsubscribe

MEMS & Nanotechnology Exchange     About Us