MEMS technology

Semtech Taps IBM For New Chip Technology
The firm said it is using IBM's 3d through-via (TSV) technology for the new chips, which have applications in fiber optic telecommunications, ...
today - MEMS technology
TSMC announces 3DIC Chip Technologies using TSVs
TSMC prototyped a module by using elemental technologies such as TSV, rewiring layer and micro bump and three-dimensionally stacking semiconductor chips and ...
today - MEMS technology

MEMS business

Boston Micromachines, Bridger Photonics sign consulting deal
“We recognized that Boston Micromachines is a world leader in deformable MEMS membranes. The two companies' technologies complement one another very well, ...
today - MEMS business
STMicroelectronics Takes Pressure Sensors to New Heights
Manufacturing the device in this way eliminates wafer-to-wafer bonding and maximizes reliability. The pressure sensor in the LPS001WP is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined ...
ACASTRO today - MEMS business
Hartotop: Sensational Smart Clothing
Micro-system technology is always smaller components allows intelligence to be mixed with other exclusive products, no results on the offensive load. A model of cross between humans and the environment, particularly clothing. ...
TanawatCubic today - MEMS business

Featured Process

e-Beam Lithographic Services from MNX

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Event Calendar

3-D Architectures for Semiconductor Integration and Packaging
2010-12-08 - 2010-12-10
San Francisco, CA USA
Keys to Design, Manufacturing, and Markets

Meet MNX at this event

2011-01-23 - 2011-01-27
Cancun, Mexico
The 24th International Conference on Micro Electro Mechanical Systems

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

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