MEMS technology

thumbnailGyro-sensor from Epson Toyocom offers two simultaneous output modes
... material with excellent characteristics such as excellent frequency stability and high precision, and “MEMS” (micro electro mechanical system). ...
today OptoIQ - MEMS technology

MEMS business

Leading the charge
Batteries were among the technologies explored at a symposium Thursday afternoon at the College of Nanoscale Science and Engineering, which drew more than ...
2011-02-05 Albany Times Union - MEMS business
I-Micronews - MEMS TECHNO: STMicroelectronics extends Sound ...
The new device, the STA321MP, joins ST's SoundTerminal® audio IC family, and features a built-in interface for a MEMS digital microphone as well as a standard microphone input. With tiny dimensions and low sensitivity to noise from LCDs ...
today - MEMS business

Nanotechnology

thumbnailNew Imaging Concept Visualizes Plasmonic Fields at Nanoscale
Researchers at Lawrence Berkeley National Lab (LBNL) collaborated with the Department of Energy Nanoscale Science Research Centers and MIT to create some ...
today VizWorld.com - Nanotechnology
thumbnailFirst lasers grown directly on silicon chips
The elusive goal of integrating lasers and electronics has come a big step closer with the first growth of nanoscale lasers directly on silicon. ...
today New Scientist - Nanotechnology

Featured Event

Packaging for MEMS
The course will address techniques for packaging (wafer level and die), packaging equipment, and device testing. Specific examples of MEMS packages will be used to illustrate the equipment and processes to be considered for MEMS devices. Various packaging schemes will be presented and their strengths and shortcomings will be discussed. Supplier and vendor activities in support of MEMS and future packaging trends will be discussed and information on the status of MEMS packaging and how it is evolving will be presented. Click here to register.

Event Calendar

MIG M2M Forum
2011-03-16 - 2011-03-17
Doubletree San Jose Hotel
Strategies to Reduce Time and Cost of MEMS End-of-Line Testing

Packaging for MEMS
2011-03-31 - 2011-04-01
Boston MA
Understanding MEMS Packaging is Critical to a Viable Product

Transducers' 11
2011-06-05 - 2011-06-09
Beijing, China
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems

Microtech Conference & Expo 2011
2011-06-13 - 2011-06-16
Boston MA
Uniting innovators to bring microtechnology from laboratory to marketplace

MEMS Executive Congress 2011
2011-11-02 - 2011-11-03
Monterey, CA
Connecting the MEMS supply chain with MEMS end-users

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