Alex Usenko 22 Indian Pipe, Painted Post, NY 14870 ÃÂâÃÂÃÂÃÂà(908)656-6700 ÃÂâÃÂÃÂÃÂàusenko@yahoo.com
Objective Principal Scientist ÃÂâÃÂÃÂÃÂÃÂPhysics, Materials, Semiconductors Summary R&D professional. Innovator and workaholic with proven track of records ÃÂâÃÂÃÂÃÂàover hundred patents and publications, many new products launched. Ready to work for a Company that value commercializing revolutionary inventions to open new markets Skills ÃÂâÃÂÃÂÃÂâ Semiconductor Materials and Devices ÃÂâÃÂÃÂÃÂâ Silicon Process Technologies: wafer bonding, ion implantation, plasma and chemical etch, epitaxy, film deposition, oxidation, etc. ÃÂâÃÂÃÂÃÂâ Hands-on semiconductor processing in cleanroom facilities ÃÂâÃÂÃÂÃÂâ Layer transfer (smart-cut) technology ÃÂâÃÂÃÂÃÂàfor silicon, GaN, SiC, Sapphire, etc. ÃÂâÃÂÃÂÃÂâ Glass and Ceramics ÃÂâÃÂÃÂÃÂâ Innovative thinking, use TRIZ (Theory for Inventive Problem Solving); inventor ÃÂâÃÂÃÂÃÂâ Prototype manufacturing ÃÂâÃÂÃÂÃÂâ Ability to work under pressure and deadlines, independently, take initiative and responsibility ÃÂâÃÂÃÂÃÂâ Securing government and venture capital funds for company R&D Experience Research Associate Corning, Inc., Corning, NY 2008 ÃÂâÃÂÃÂÃÂà2012 ÃÂâÃÂÃÂÃÂâ Discovered self-organizing process to make moth eye surface on glass ÃÂâÃÂÃÂÃÂàthus making glass non-glare, non-reflective, fingerprint repelling, antimicrobial, scratch resistant and self-cleaning ÃÂâÃÂÃÂÃÂâ Invented new process transforming glass into ceramics ÃÂâÃÂÃÂÃÂàuseful, say, for making interposers ÃÂâÃÂÃÂÃÂàsheets on which semiconductor chips are assembled ÃÂâÃÂÃÂÃÂâ Suggested new concept to add self-cleaning and disinfecting functionality to faces of handheld devices (by photocatalysis) ÃÂâÃÂÃÂÃÂâ Invented silicon-on-glass layer transfer process ÃÂâÃÂÃÂÃÂàlicensed by industry leader in Smart-Cut Chief Scientist MEC Tech, Toms River, NJ 2005 ÃÂâÃÂÃÂÃÂà2008 ÃÂâÃÂÃÂÃÂâ Lead development of new products as 450mm silicon focus rings for plasma equipment Chief Technology Officer, Co-Founder Silicon wafer Technologies, Newark, NJ 2000 ÃÂâÃÂÃÂÃÂà2005 ÃÂâÃÂÃÂÃÂâ Identified sources, prepared applications, and secured Company funding from Small Business Innovation Research (SBIR) and other government and state sources, about $2M total ÃÂâÃÂÃÂÃÂâ Invented improved layer transfer (smart-cut) process for making silicon-on-insulator wafers ÃÂâÃÂÃÂÃÂâ Covered Company product ÃÂâÃÂÃÂÃÂàsilicon-on-insulator wafers ÃÂâÃÂÃÂÃÂàwith numerical patents ÃÂâÃÂÃÂÃÂâ Prepared company business plan and presented to prospective investors ÃÂâÃÂÃÂÃÂâ Worked with Silicon Valley, Boston, and New York City venture capital firms to fund Company scale-up Director, Silicon-on-Insulator Projects New Jersey Microsystems, Newark, NJ 1997 ÃÂâÃÂÃÂÃÂà2000 ÃÂâÃÂÃÂÃÂâ Developed display for an universal communication device (under contact with CopyTele, like todayÃÂâÃÂÃÂÃÂÃÂs iPhone) ÃÂâÃÂÃÂÃÂâ Invented system-on-chip process combining CMOS and MEMS Education PostDoc New Jersey Institute of Technology, Newark, NJ 1996 Micro-electro-mechanical systems (MEMS) PhD Moscow Technological University, Moscow, Russia 1986 Material Science, Physics MSEE Moscow Institute of Electronic Technology, Moscow, Russia 1980 Semiconductors, Electrical Engineering Consulting ÃÂâÃÂÃÂÃÂâ Transferred my expertise in layer transfer technology to Samsung-Corning Precision (Seoul, South Korea) to make initial substrates for light emitting diodes (LED) ÃÂâÃÂÃÂÃÂâ Technical and patent-related consulting though Gerson Lehrman Group, NEWN, etc. on semiconductor materials ÃÂâÃÂÃÂÃÂâ Consult New York venture capital firms as Carrot, etc. on semiconductor projects ÃÂâÃÂÃÂÃÂâ Referee for top professional journals as IEEE Transactions on Electronic Devices, IEEE Transactions on Nuclear Sciences, Semiconductor Science and Technology, Journal of Physics D, etc. Teaching PhD thesis advisor. All my grad students at New Jersey Institute of Technology, and Moscow Technological University successfully graduated and landed good jobs. Awards SBIR Phase I, II contracts from US Ballistic Missiles, Navy, Army, National Science Foundation, etc. Research grants from Soros, NATO, Fulbright foundation, etc. Publications 100+ papers including in top referred journals as Journal of Material Science, Japanese3 Journal of Applied Physics, Journal of electronic Materials, IEEE Transaction on Nanotechnology, etc. 20+ American patents (number rising), dozen Soviet patents, many International Patent Applications References Please ask
