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Timothy Harpster's Resume
File Attachments:
TJ Resume.pdf (140.0 KB, application/pdf)
attached by tharpste (Timothy Harpster) on 2006-01-16 23:21

Contact629 Brooks St.
Ann Arbor, MI 48103
US
7343307363
[email protected]		 GoalTo obtain a position where I can apply science and engineering principles to reach targeted goals. <see resume for more>
SkillsWafer-level hermetic packaging for implantable microsystems, Microfabrication, MEMS sensors, Studies on wafer bonding materials, lifetime testing
QualificationsPlease see resume
Updated: 2006-01-17
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