A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here

James Steck's Resume

Contact4108 Greenridge Rd. #3
Pittsburgh, PA 15234
US
412-952-7310
[email protected]
GoalTo obtain a position in a nanotechnology-based company in the research, development, and processing of new products and services.
SkillsPos. and Neg. Photolithography, Wet and Dry Etch, Metrology and Characterization, III-V's, Thin Films Deposition and Growth, LOCOS, HIVAC sys., SEM's
QualificationsSept. 2003 – May 2006
California University of Pennsylvania California, PA
BS in Nanofabrication Industrial Technology
Some education obtained at Pennsylvania State University’s Nanofabrication Facility, during summer 2005 with a 4.0 GPA.
Worked in a Class 10 clean-room environment
Learned positive and negative photolithography and exposure techniques
Learned and operated scanning electron microscopes, optical microscopes,and other metrology and characterization techniques
Learned and operated reactive ion etchers and wet etching
Learned ion implanters
Learned and operated film deposition systems for depositing aluminum films of various thicknesses (50 – 300 Ang. thickness) onto silicon and silicon oxide substrates for the creation of basic MOSFET structures
Learned film growth furnaces
Learned LOCOS, III-V’s, and metal and dielectric coatings
Experience in project/product development.

Professional experience

July 2006 - Present
The Ex One Company
Irwin, PA
Laser Tech/Ultrasonic Engineering

Operation, development, and construction from print of a new laser drilling system called Orion, which uses two lasers to drill various size holes with controlled tapers into many different materials, from metals to ceramics.
Operation and maintenance of Sonex ultrasonic machining system, which uses ultrasonic vibrations to machine materials. Maintenance includes electronic and mechanical troubleshooting from prints. Used prints alone to tear down and deep clean all mechanical parts of the machining head and then rebuild. Research and development of machining procedures to machine various advanced brittle materials, such as CMC, ceramics, glass, Pyrex, etc. Also includes rebuild of RAM and Wire EDM machines from partial prints.

August 2001 – January 2002
Kurt J. Lesker Co. through PEAK Technical Services
Electronics Technician

Electronics technician to work on the Gas Abatement system. Began development of a motor controller. Helped run the pump shop while supervisor was gone. Assisted in electrical troubleshooting of pumps. Repaired electrical equipment around the shop.

June 2000 – May 2001
Varian Semiconductor Equipment Associates
Gloucester, MA
Final Test Technician

Final Test and Installation of VIISTA-80 Ion Implantation Systems
Worked in a Class 100 clean room. After all parts were assembled in the clean room, connected power and turned on the machine. Required to bring the system to full operational status, even if nothing happened when power was applied.
Required mechanical, electrical, and electronic troubleshooting from prints.
HVAC systems, up to 10-9 psi, Hi-Voltage PS, up to 25KV, Robotics and Control Systems, Wafer Handling and Cleaning Processes, 200 and 300mm


May 1994 – June 2000
United States Navy
Norfolk, VA
Electronics Technician

Electronics Technician on submarine and surface ship
Worked on nuclear reactors to power the submarine. Operated all panels necessary to safely operate the reactor, and performed preventative and corrective maintenance on same panels, using prints and manuals.
Repaired radar and communications equipment, and computers.
Honorable Discharge at E-4 pay grade

Professional memberships
Active Member of EPT, Technology Honorary.

Security clearance
Inactive Confidential Security Clearance, granted in 1998.

Updated: 2007-07-23
Terms of Use | Contact Us | Search
  • Files