| Rupal Jain's Resume File Attachments:
RupalJain_resume_v1.pdf (114.5 KB, application/pdf)- Resume
| Contact | 8001, Lakecrest Drive
Apt#103
Greenbelt, MD 20770
US
240-274-8573
rupal@umd.edu |
Goal | Full-time position in the field of Microelectronics and MEMS/Electronic Chip Packaging |
| Skills | Photolithography,PVD,Etching (Wet&Dry),EVG aligner,bonder,Device Physics,Polymers,SEM,AFM,X-ray,Labview,DOE,Process control,Statistics,FEA,AutoCAD |
| Qualifications | Master of Science, Mechanical Engineering, expected July 2007
University of Maryland, College Park, Maryland
GPA: 4.0/4.0
Expertise
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MEMS/Packaging:
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Photolithography, Metal Deposition Techniques (PVD - sputtering, e-beam evaporation, thermal evaporation, CVD), Thin film characterization, Etching (Wet and Dry), EVG back-side aligner, Wafer bonder, Device Physics, Flexible Macroelectronics, Polymers (Polyurethane, PDMS), MEMS Packaging: Two year cleanroom experience at FabLab in Maryland NanoCenter, UMD.
Microstructural Characterization Techniques:
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Scanning Electron Microscopy (SEM) with Electron Dispersion Spectroscopy (SEM-EDS), Scanning Acoustic Microscopy (SAM), X-Ray transmission (XRT) and X-ray fluorescence (XRF), Atomic Force Microscopy (AFM), Magnetic Force Microscopy (MFM).
Experimental:
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Data Acquisition and Analysis, Labview, Design of Experiment (DOE), Statistics measures, Finite element modeling (FEM)
Computer and Programming:
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C, C++, Matlab, Adobe Illustrator, Comsol Multiphysics 3.3, AutoCAD-2000, Mechanical Desktop
|
Updated: 2007-05-29 |
MEMS and Nanotechnology Clearinghouse