Tim Westmore's Resume
File Attachments:
CV Westmore 23-May-07.pdf(26.6 KB, application/pdf)
| Contact | 641, Park Street Salinas, CA 93901 US (408) 204-0739 twestmore@comcast.net |
Goal | Contribute to the success of a company focused on MEMS | |
|---|---|---|---|---|
| Skills | Fabrication, packaging, and characterization of MEMS devices and products | |||
| Qualifications | AREAS OF EXPERTISE • Fabrication, packaging, and characterization of MEMS devices and products • Surface and materials analysis using electron spectroscopy • Wafer fabrication processes including diffusion, implant, and thin film deposition • Statistical process control and design of experiments WORK EXPERIENCE Staff Engineer, Silicon Light Machines, Sunnyvale, CA May 2001 to April 2004, May 2005 to present General responsibilities include developing, implementing, and qualifying new processes and products; characterizing yield and reliability failures; and supporting company efforts in materials analysis. Silicon Light Machines designs and develops a MEMS diffraction grating with applications in lithography, display, printing, and telecommunications. Accomplishments • Developed a process to eliminate the loss of selectivity in a XeF2 release that results from excess silicon (patent application filed); the sawn-edge passivation process enables release of a singulated MEMS devices • Developed and demonstrated release-first and release-in-package packaging process flows for an electro-optical device; both flows allow packaging of fragile MEMS structures • Determined the root cause of reliability failures for a thin film stack and assisted in developing improvements to the structure; the analysis identified areas of improvement for a wafer-level membrane packaging structure for RF devices • Determined activation energy for operating stability in a Grating Light Valve; the results led to confirmation of surface charge carriers as a cause of unwanted changes in operating voltage • Introduced an acceleration scheme to measure hillock and void formation in a MEMS structure created by a thermal gradient; the approach improves lifetime testing capabilities • Analyzed the nitridization of titanium films in the development of conductive structures that enable stable operating voltages for a MEMS diffraction grating • Qualified and implemented an improved glass cover brazing process, for wafer-level packaging, that eliminated glass cracks and a significant reliability concern • Performed root cause failure analysis and implemented corrective action to solve a wafer-level hermetic solder seal failure; the solution played a significant role in allowing the company to complete development of a dynamic gain equalizer product Current Projects • Project leader for developing a cavity package, including the assembly and backend processing; the new product and expands the company’s applications base into UV lithography • Project leader for implementing and qualifying a new device with increased light attenuation and reflectivity; encompasses process development, optical characterization, and reliability qualification; improvements increase throughput in customer computer-to-plate printing Materials Analyst, Accurel, Sunnyvale, CA, March 1998 to April 2001 Responsible for providing contract materials analysis services on thin films, integrated circuits, and magnetic structures using AES, XPS/ESCA, AFM, and RBS; services provided for characterization or problem solving with written and verbal reports to customers; responsibilities also included developing customer relations and business strategies to increase group/company revenue Accomplishments • As manager of the surface analysis group, increased the group’s annual revenue by more than 50% in less than two years, exceeding $500K and surpassing projections Staff Engineer, IBM Almaden Research Center, San Jose, California, May 1996 to March 1998 Sputter deposited GMR thin film structures for the development of non-volatile memory applications; analyzed materials and thin film structures using RBS, AES, XRD, XRF, and SEM; repaired and/or maintained analysis equipment including a high-energy ion accelerator and an x-ray diffractometer; research projects include inter-diffusion in copper nickel thin films to help understand reliability issues in magnetic head structures Process Engineer, Genus, Sunnyvale, California, March 1995 to April 1996 Characterized and developed tungsten-silicide and tungsten-nitride thin film processes for the applications and technology development labs; qualified tungsten-silicide deposition processes at customer sites Process Engineer, Integrated Device Technology, San Jose, CA, March 1992 to November 1994 Sustained diffusion, implant, and thin film wafer fabrication processes including PECVD dielectric films and LPCVD polysilicon/silicon nitride Process Engineer, Teledyne Components, Mountain View, CA, January 1990 to July 1991 Sustained, improved, and/or developed diffusion and thin film wafer fabrication processes including diborane pre-deposition and PECVD nitride passivation; implemented computerized data collection for in-line measurements as part of an effort to improve manufacturing through statistical process control EDUCATION BS, Materials Engineering, Loughborough University of Technology, Leicestershire, UK, 1989 MS, Materials Engineering, San Jose State University, San Jose, California, 1997 OTHER INTERESTS Archeology – expeditions on the colonial spice trade (Banda Neira, Indonesia); Paleo-Indian mineral mining (Mammoth Caves, Kentucky); Polynesian survival culture (Easter Island, Chile); and the development of the Iron Age Khmer Civilization (Ban Non Wat, Thailand) Teaching – teaching a course titled Introduction to the Science and Engineering of Materials; an introductory lower division survey course on engineered materials; includes preparation of both course and lab work Marine Biology - Captured identification photographs of whales for conservation efforts Photography |
|||
Updated: 2007-05-26