| Chih-Peng Hsu's Resume File Attachments:
Resume_Chih-Peng Hsu_wo.pdf (83.0 KB, application/pdf)
| Contact | Dept. of Electrical Engineering
Paul Allen Center-Campus Box 352500
Seattle, WA 98195-2500
US
206-234-1338
cphsu@u.washington.edu |
Goal | To pursue a full-time MEMS/Device/Process engineer position or related engineering filed. |
| Skills | Microfabrication Techniques, MEMS Modeling, Semiconductor Device Physics and Modeling of VLSI Fabrication Process, Thermal Management of Electronics |
| Qualifications | <Education>
PhD in Electrical Engineering at University of Washington, Exp. Grad. Date: Jun 2008.
MS in Electronics Engineering at National Tsing Hua University, Jun 2002
<Experimental Skills>
Microfabrication Techniques: photolithography, thermal oxidation, wet chemical processing, evaporation, sputtering, reactive ion etch (RIE), deep RIE, and LPCVD.
Characterization Tools: Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EADX), NanoSpec, Alpha Step Profilometer
<Computer Skills>
Computer Languages and Skills: LABVIEW, MATLAB, Origin, MS-Office
CAD Tools: L-Edit, Coventor, Femlab, TSuprem4, Medici, Cadence, Verilog, Hspice
<Languages>
Native in Mandarin and fluent in English.
<Related Graduate Courses at University of Washington, Seattle>
1.Sensors and Sensor Systems
2.Microelectromechanical Systems (MEMS)
3.Modeling of MEMS and Sensors
4.Solid State Laboratory Techniques
5.Semiconductor Device Physics
6.Physics and Modeling of VLSI Fabrication Process
7.Heat Transfer
8.VLSI & VLSI Testing |
Updated: 2008-03-13 |
MEMS and Nanotechnology Clearinghouse