Looking for Semiconductor/MEMS Process Integration Engineer, MEMS design/test Engineer
Skills
fabrication process, AutoCad, L-Edit; COMSOL and ANSYS, Matlab; AFM SEM, XPS, profiler, vector network analyzer, multimeter, oscilloscope
Qualifications
Eight years hand-on experience in design, simulation, fabrication, characterization and failure analysis of the semiconductor or MEMS devices. Ability of improvement of device performance/yield based on DOE, SPC and semiconductor/MEMS fundamental knowledge.
Worked project 1. Infrared image sensor array, THz image sensor array, radiation detector, and neutron detector 2. Wireless sensing pressure sensor 3. Flow sensor, bio-chip for protein separation and PCR 4. Corresponding circuit design for MEMS sensor control.
Skills
1. Mask pattern design: AutoCad and L-Edit 2. Device FEA simulation, RF analyses and calculation tools: COMSOL, ANSYS, AWR, HFSS Mathematica, 3. Mask shooting: Laser writer (Heidelberg DWL66) 4. Photolithography: 5x i-line Stepper (GCA 6300), Contact aligner for double sides alignment (Carl Suss MA6), Spin coating and Development (S1813, SPR220 series, SU-8 series, TOK series, KMPR series, nLOF) 5. Film deposition: E-beam evaporator (Cr, Au, Al, NiCr, Cu, Ti), Sputtering (AJA) (Cr, Au, Pt, Ti, Ni, Cu, SiO2, AlCuSi, ITO), PECVD (LS SiN, ST SiN, SiO2), and LPCVD (SiO2 and SiN), parylene deposition and PDMS casting 6. Electroplating: Ni, Cu, Au with electroplated thickness up to 60õm 7. Film processing: Wet etching (Si, SiO2, Al, Cu, Ni, Au, Cr, NiCr, Ti), Deep silicon ICP etching with aspect ratio >20:1 (Plasma-Thermal), Fluorine-based (CHF3/O2, CF4) plasma etching (Si, SiO2, SiN, PDMS), O2 plasma etching (resist, SU-8, parylene), Chlorine-based plasma etching (Al) and Lift off process. 8. Packaging and characterization: Gold ball bonder, wafer bonding (glass-glass, PDMS-glass, PDMS-PDMS, SU-8-SU-8), Dicing saw, Profilometer, Ellipsometer, Scanning electron microscope (SEM), Atomic force microscopy (AFM), Vector/scalar network analyzer (VNA/SNA) for RF measurement, RF/DC probe station, X-ray photoelectron spectroscopy (XPS), and Syringe micropump 9. VHDL, ModelSim, PCB tools, Synopsis, Cadence IC, and Encounter for IC design, simulation, and wire placement
