1.B.E. Electronics Science and Technology(2010) Huazhong University of Science and Technology Wuhan,China
2.M.S. Microelectronics Engineering and Solid State Electronics (2013) Peking University Beijing,China
RESEARCH EXPERIENCE 1 Design an inertial micro-switch (Jan-Oct 2012 ) âÃÂâ The switch was designed to prolong contact time âÃÂâ A physical model of the switch was established to optimize the device structure and simulated by ANSYS and Simulink. âÃÂâ The switch was fabricated by bulk micromachining process(@National Key Laboratory of Micro/Nano Fabrication Technology at Peking University)
2 Study on BCB bonding process (Oct-Dem 2011) âÃÂâ Individual test of BCB bonding was passed to get the best term of the process âÃÂâ Flow behavior of BCB in adhesive bonding was studied so as to reduce transverse deformation of BCB structure
3 Design a differential piezoresistive pressure sensor (Jun- Oct 2011) âÃÂâ The position of the piezoresistive resistance was optimized by ANSYS âÃÂâ The process of piezoresistive resistance was simulated by Silvaco to meet the design demand âÃÂâ The sensor was fabricated by bulk micromachining process
4 Tapeout a piezoresistive accelerometer (Jan- May 2011 ) âÃÂâ The sensor was fabricated by bulk micromachining process(@National Key Laboratory of Micro/Nano Fabrication Technology at Peking University)
