Packaging the Next Generation of Nano Devices2013-04-30 - 2013-05-01
Advanced Technology Workshop and Tabletop Exhibits
Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.
For more information: http://www.imaps.org/nano/index.htm