Brewer Science created the ZoneBOND™ process as a solution for the market need of temporary wafer bonding process that offers excellent total thickness variation (TTV) control across the device wafer, high-temperature stability, and debonding under low-stress conditions to preserve thin wafer integrity.
Advantages of Brewer Science® ZoneBOND™ processing include:
Higher yields at debonding:
Low-stress thermal and mechanical debonding protects the fragile device wafer.
Separation takes place between the adhesive and the carrier wafer, not the adhesive and device wafer.
During separation, the device wafer is on film frame or other carrier, safely mounted on a vacuum chuck.
Higher throughput and lower cost of ownership:
Targeted to be much higher debonding throughput than competitive solutions.
A low-stress debonding process detaches the carrier wafer from the laminated device wafer at room temperature using very low mechanical force for the separation. The technology utilizes two different zones for controlled adhesion of the device wafer to the carrier wafer. The device wafer is truly adhered to the carrier wafer, only in a small area along the outer edge of the carrier wafer, while the rest of the wafer remains unbonded but completely supported.