and information portal
for the MEMS and Nanotechnology community
What is MEMS?
ProtoSi -- Reliable MEMS Processing
MEMS Process Specialists: DRIE, Spray Resist (thick and conformal), Sputter, Wafer bonding, Sealing, Flip-Chip bonding and direct-write conductive ink.
Silicon DRIE: SOI, thru-wafer, TSV, metals OK.
Spray Resist: conformal, post-DRIE.
Sputter: Au, Cu, TiW...
Wafer Bonding: hermetic seal & packaging.
Direct-write conductive ink.