Hi,

I'm using CYTOP (CTL-809M) to make a dielectric layer on aluminum coated
wafer.I spin coat Cytop of thickness 1~2.5 microns.I need to etch away CYTOP
on the edge of the wafer (about 3 mm at the flat edge of wafer). I was using
adhesive tape to cover the places were I don't want the Cytop. But as we all
know that adhesive tape use is very rough process.Consequently I was not
able to make fine features as I needed. I looked on net but can't find any
helpful things.

I was wondering if someone can help me out in this? It would be great of any
one can email the process for the for removal of Cytop.


Thanks and Regards,
Pradeep