The company's extensive experience in AP includes die bonding, wafer bonding, extreme wafer thinning, copper and nickel damascene RDL, silicon interposers, chiplets, and micro transfer printing.
The aim is to give professors, researchers and PhDs the opportunity to conceive, design and develop microelectromechanical systems (MEMS) technology and to create new MEMS products, said the ...
AMD has already developed a number of unique solutions based on its nanomaterial technology, including sustainable RFID and flexible/stretchable sensors using conductive inks Advanced Material ...
SUTD researchers have used nanotechnology to create a unique print that displays a glasses-free 3D image under ordinary white light. The appearance of the image changes as the print is viewed from varying angles.
