| MEMS and Nanotechnology Clearinghouse
To purchase MEMS-related materials, supplies, equipment, wafers,
etc.,please visit the links section of
the MEMSNet site.
| Property↑↓ | Value↑↓ | Conditions↑↓ | Reference↑↓ |
|---|
| Elastic recovery during unloading | 0.25 | Thickness=0.5um,deposited on a tool steel substrate by magnetron sputtering method. | Thin Solid Films,246(1994), p.108 | | Hardness,load-off | 9.05 GPa | Thickness=0.5um,deposited on a tool steel substrate by magnetron sputtering method. | Thin Solid Films,246(1994), p.108 | | Hardness,load-on | 6.3 GPa | Thickness=0.5um,deposited on a tool steel substrate by magnetron sputtering method. | Thin Solid Films,246(1994), p.108 |
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